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Seminar: Large Area Energy Autonomous Electronic Skin, Prof. Ravinder Dahiya, University of Glasgow

Wednesday 31 March 2021, 12.00-13.00
Zoom (contact for access)

Abstract: The miniaturization led advances in microelectronics over last half century have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as electronic skin in robotics, wearable systems, and healthcare technologies etc. Often these applications require electronics to be soft and squishy so as to conform to 3D surfaces. These requirements call for new methods to realize sensors, actuators electronic devices and circuits on unconventional substrates such as plastics, papers and elastomers. This lecture will present various approaches for obtaining distributed electronic, sensing, energy and computing devices on soft and flexible substrates, especially in context with the tactile or electronic skin (e-Skin). These approaches range from distributed off-the-shelf electronics integrated on flexible printed circuit boards, to novel alternatives such as e-Skin constituents obtained by printed nanowires, graphene and ultra-thin chips, etc. The technology behind such sensitive flexible and squishy electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health etc. This lecture will briefly discuss how the flexible electronics research may unfold in the future.

Bio: Ravinder Dahiya is Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow in the School of Engineering at University of Glasgow. He is the Director of Electronic Systems Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group. His group conducts fundamental research on flexible/printed electronics, electronic skin, and their application in robotics, prosthetics and wearables.

Prof. Dahiya has published more than 400 research articles, 7 books, and 15 submitted/granted patents. He has given more than 150 invited/plenary talks. He has led and contributed to many international projects (> £30M) funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council.

Prof. Dahiya is President-Elect of IEEE Sensors Council. He is also the Distinguished Lecturer of IEEE Sensors Council and is serving on the Editorial Boards of several leading journals. He had been on technical programme of several leading international conferences and was the Technical Program Chair for IEEE Sensors Conference 2017 and 2018. He is the Founding Chair of IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS).

Prof. Dahiya holds EPSRC Fellowship and received Marie Curie Fellowship and Japanese Monbusho Fellowship in past. He has received several awards, including 9 best journal/conference paper awards as author/co-author. He also received IEEE Sensor Council Technical Achievement Award and Microelectronic Engineering Young Investigator Award (Elsevier) and 2018 Elektra award for best university research in the UK. Prof. Dahiya is Fellow of IEEE.

Personal website:


Twitter: @RavinderSDahiya

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